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UV laser marking machine
Product Category: Laser Engineering
Attributes: suitable for fine marking, fine cutting, and micro processing of special materials.It is mainly used for marking and surface treatment of various glass, LCD screens, thin ceramics, semiconductor silicon wafers, PCB board marking, scribing, silicon wafer microvias, IC dies, sapphire, polymer films and other materials.Features: 1. High laser frequency, high output laser stability, easy to debug marking effect 2. Fully enclosed design of the processing area to ensure improved safety protection during processing.3. High-performance ultraviolet laser, small laser and spot output, good optical mode, thin marking lines, suitable for marking and cutting of fine graphics.

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